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A basic understanding of material performance is necessary for both the designer and fabricator of the printed wiring board (PWB). Understanding the materials available is one of the primary tasks for designing for manufacturability and performance. It is necessary to match the product end-use performance requirement as well as the environmental exposure the board experiences in the fabrication and circuit card assembly (CCA) processes with the capabilities of the material. It is common for boards to experience as many as five thermal excursions in CCA. With the introduction of the RoHS directive, the temperature at which the board is assembled is typically 30 to 40 C higher than usual eutectic reflow temperatures. Current lead-free pastes require peak temperatures from 230 to 250 C. The actual peak temperature for any CCA is a variable based on the specific alloy paste, the component lead metallurgy, and also the combined component and board mass. Many studies have reported data that document the plated through hole damage that accumulates from successive reflows as a function of the expansion of the laminate with increasing temperature. Other experiments have demonstrated that the peak temperature has a primary effect on the ability of the PCB to withstand assembly without delamination or ruptured vias. Materials have been developed to withstand these higher lead-free assembly (LFA) temperatures with residual life cycle reliability. However, quality and reliability of any unique part is codependent on processing and design variables in conjunction with the proper material selection.

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IPC-4101 Specification To facilitate the many choices of laminates and their associated properties, industry standards groups such as the IPC have defined minimum performance specifications and have issued several specifications to inform the selection process Some of the most commonly used material specifications are those that deal with laminate, prepreg, and copper foil IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards, and IPC-4652, Metal Foil for Printed Wiring Applications, are the primary specifications for clad laminates, prepregs, and foils Another specification, IPC- 4104, Specification for High Density Interconnect (HDI) and Microvia Materials, deals with many of the new materials for HDI, such as epoxy-coated microfoils, as discussed in this chapter The bare-board base materials are identified by using the classification system found in IPC-4101, which has specification sheets for various grades of material.

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The specification sheet is also known as a slash sheet since each material specification is preceded by a forward slash (/) Each sheet s heading typically identifies the resin system, the reinforcement, flame retardant, presence of fillers, as well as some performance parameters, such as glass transition temperature (Tg) or decomposition temperature (Td) More detail is in Sec 2722 27211 Keywords IPC-4101B includes Keywords to assist the user to select slash sheets that have applicability to a typical use The specification cautions that Keywords are not specification requirements and having a particular Keyword in the header section, does not guarantee the acceptability of this material for a specific application Nor are Keywords meant to convey the only use for that material.

counter/timer is enabled through the TCCR0 register. After the Timer/Counter0 overflows, it resets to $00 and continues counting up for each Timer/Counter0 clock signal. (Figures 3.13 and 3.14.)

The Keywords used in this chapter to point to particular materials by slash sheet are: RoHS compliant, Low Halogen Content, CAF Resistance, and High Decomposition Temperature 27212 Limitations of Specification IPC-4101B also includes guidance on qualification assessment for base materials The user of this specification should be aware, however, of the boundaries and caveats of this specification and the consequent responsibility on the stipulator.

to understand these limits The tests proscribed in IPC-4101 are on either raw cores or prepregs laminated into simple cores The manufacturer of base laminates must test its laminates for the inherent properties of the materials, before transformation by fabrication processes This means that the data are relevant to compare materials to a baseline value and like materials to each other, but these are not tests for post-fabrication long-term reliability or time to failure in the end-use environment (with the exception of CAF resistance, which is an optional test), although they can be and are indicators of reliability for a particular use when properly understood 272121 Conductive Anodic Filament (CAF) Resistance The Keyword CAF Resistant is more of a descriptive than quantitative term CAF growth resistance is tested per test method 2625, but the acceptability of the results is stated only as Pass/Fail.

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